DIFFUSION BONDING

Diffusion Bonding

Diffusion bonding

By stacking multiple thin metal plates made by photoetching and diffusion bonding at the atomic level of the metal, we can achieve three-dimensional molding that is difficult with etching, including fine holes and thickness exceeding the processing limit, in order to create products with a high aspect ratio that cannot be achieved by etching, or cutting and machining alone.

Advantages of processing by diffusion bonding

・ High strength due to lamination of thin plates and little change in product dimensions
・ Compared with other construction methods, mass production is possible, and a reduction in manufacturing cost can be achieved
・ Complicated shapes, such as deep holes, tapered holes, and flow path structures can be manufactured in any shape

Advantages of processing by diffusion bonding

Joinable materials

Stainless steel + stainless steel
Example; SUS304 + SUS304 SUS430 + SUS430

42 alloy + 42 alloy
Amber + amber
Titanium + titanium
Copper + copper

Product pictures and applications

Fuel cell separator Evaporation mask Suction plate
Carrier tape Semiconductor manufacturing jig Electronic components
Various filters Heat exchanger related Fuel cell related parts
Wire bonder Heat sink, etc.
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