Diffusion Bonding
Diffusion bonding
By stacking multiple thin metal plates made by photoetching and diffusion bonding at the atomic level of the metal, we can achieve three-dimensional molding that is difficult with etching, including fine holes and thickness exceeding the processing limit, in order to create products with a high aspect ratio that cannot be achieved by etching, or cutting and machining alone.
Advantages of processing by diffusion bonding
・ High strength due to lamination of thin plates and little change in product dimensions
・ Compared with other construction methods, mass production is possible, and a reduction in manufacturing cost can be achieved
・ Complicated shapes, such as deep holes, tapered holes, and flow path structures can be manufactured in any shape
Joinable materials
Stainless steel + stainless steel
Example; SUS304 + SUS304 SUS430 + SUS430
42 alloy + 42 alloy
Amber + amber
Titanium + titanium
Copper + copper
Product pictures and applications
Fuel cell separator | Evaporation mask | Suction plate |
Carrier tape | Semiconductor manufacturing jig | Electronic components |
Various filters | Heat exchanger related | Fuel cell related parts |
Wire bonder | Heat sink, etc. |